Description

A Fire retardant, Filled Epoxy Resin System which cures at room temperature, suitable for Electrical and Electronic Potting/Casting applications. Epofil–60–FR is specially formulated and processed to obtain void free encapsulation and castings to get good electrical properties. It is a ready to use filled system having low viscosity at processing temperature. The system is modified with special anti-settling agents to avoid heavy settling on storage. However the filler settling in the system is very soft and could be re-mixed easily. Epofil–60–FR can be used with room temperature curing Hardener–PAM or Hardener–AMD.